Under the nanoLINK initiative (see www.nano-link.net)

the EU support projects MINAEAST-NET and MINOS-EURONET are disseminating information through
a n@noLINK e-newsletter (continuing the dissemination done previously by the e-newsletter MINAEAST-NET)

Week 9-11, No.16 (March 22, 2006)

MINAEAST-NET information (Contract No.510420)

Web site: www.minaeast.net

1. Event in Spain
SMS 2006- Spanish Molecular Electronics Symposium, 24 March, 2006, San Sebastian, Spain (Details...)

SMS 2006 will be organised by the following Institutions: PHANTOMS Foundation, Donostia International Physics Center (DIPC), CSIC and UPV-EHU, CIDETEC and in collaboration with the NANOTRON and Pico-Inside projects.

2. Event in Turkey
International Workshop on Nanostructured Materials
, 21-23 June, 2006, Antalya, Turkey (Details...)

The workshop on Nanostructured Materials is an international workshop which emphasizes on semiconductor nanostructures, magnetic nanoparticles and catalysts. The workshop will cover fabrication of semiconductor nanostructures by ion implantation, sputtering, CVD and MBE in dielectric matrices on various surfaces and their applications to microelectronic, photonics and biotechnology; production of nano particles and thin films by sol-gel processing methods; processing and manipulation of nanostructures; electrical, magnetic, optical and chemical properties and device applications.

3. Event in France
TNT 2006 "Trends in Nanotechnology",
04-08 September, 2006 Grenoble, France (Details...)
Important Dates:
Abstract Submission (Oral request)- April 24, 2006, Student Grant Request- April 24, 2006,
Abstract Submission (Poster request)- August 01 , 2006

MINOS-EURONET information (Contract No.015704)

Web site: www.minos-euro.net

I. 4M events:

1. 4M Ceramic Cluster Workshop "Micro Machining of Ceramics", 22-23 March 2006, Munich, Germany
More information can be found at: http://www.4m-net.org/node/1227 
2. 4M Workshop "Metal Processing and Metrology", 23-24 March 2006, Budapest, Hungary
More information can be found at:  http://www.4m-net.org/node/1118

3. Business and Technology Challenges in Micro-Manufacturing, 11 April 2006, Cardiff, Wales, UK This workshop, jointly sponsored by 4M, is a one-day workshop for European industry and academia.
More information at: http://www.4m-net.org/node/1342

II. GOSPEL events and announcement:

1. Jobs position

  • The GOSPEL partner University of Barcelona offers a post doc position in the areas of smart instrumentation and signal processing for multisensor systems. It covers a three year contract and a yearly gross-salary of 24.000 €. Information: Dr. Santiago Marco ([email protected]) (Details...)
  • The Institute of Micro and Sensor Systems (IMOS) at the Otto-von-Guericke-University Magdeburg (Germany) will establish a junior research group in the field of microsystems technology and injection molding.
    They are looking for young group leaders and Ph.D. students which have experiences and interests in at least one of the fields of injection molding, ceramic injection molding (CIM), molded interconnect devices (MID), packaging and microsystems technology. The work of the group will start in June 2006 and is financed by the BMBF. Contact: Prof. Dr. rer. nat Bertram Schmidt- Sekretariat +49 (391) 67 18308 Fax +49 (391) 67 12609.(Details...)

III. STUBA event

ASDAM ’06 - International Conference on Advanced Semiconductor Devices and Microsystems, 16-18 October, 2006, Smolenice, Slovakia (Details...)

ASDAM ’06 is devoted to the latest results of research and development in the field of new semiconductor devices and microsystems. Its goal is to bring together leading experts from institutes and universities as well as companies interested in the progress of high technology devices and microsystems.

Important date: Submission of extended abstracts: May 15, 2006.

IV. PATENT DfMM events

  • Workshop on Design for Reliability and Manufacturability, 25 April, 2006, Lago Maggiore, Italy  

Co-organised by PATENT-DfMM and the NEXUS Methodology Working Groups "Reliability & Test" and "Design Modelling Simulation". Main emphasis will be on reliability and test problems, where design methodologies can lead to significant improvements. Industry’s design and reliability needs will be discussed and latest research results and new approaches will be proposed by the research community.

PATENT-DfMM is also organising a panel discussion at DTIP (27 Apr) on "Design for Reliability and Test of Microsystems" with key industry panellists.
Contact: Patric Salomon, 4M2C, Berlin, Germany, E-mail: [email protected]; www.patent-dfmm.org

  • Technology Roadmapping for Packaging of MOEMS and RF MEMS   

The first roadmapping PATENT DfMM event, hosted by HWU (16 Feb 06, Edinburgh), was a great success. 
With more than half of the 30 participants coming from industry, technological trends, bottlenecks and investment opportunities in packaging of MOEMS and RF MEMS were collected and discussed in small working groups. The workshop was viewed as innovative and very useful by all participants and a lot of progress was made during this meeting. The transcription process into a roadmap format through the project team has begun. The second meeting will be held at the Fraunhofer IZM Berlin in Germany on 8 June 2006 – further active contributors are welcome to attend.
For more information please visit website: www.patent-dfmm.org

Contact: Fabien Holler, Heriot-Watt University, Edinburgh, UK; E-mail: [email protected]

Common section (general information)

1. The 3rd International Congress of Nanotechnology (ICNT 2006), October 30- November 2, 2006, San Francisco (Details...)
Important Dates: Abstract Deadline: April 1, 2006; Deadline for Manuscript of the Proceeding: April 15, 2006; Pre-registration: May 1, 2006

2. FSRM Course: Polymer Microfabrication (2 days), Karlsruhe, Germany, 4-5 April, 2006 (Details...)
Registration deadline: March 24, 2006

Content

  • Technical and economical aspects of polymer microfabrication
  • Replication tools : Fabrication concepts and properties
  • Rapid Prototyping of Microcomponents
  • Hot Embossing : Principles, equipment, applications
  • Injection Molding : Principles, equipment, applications
  • Back-end Processes : Handling and assembly
  • Future trends
  • Laboratory visit

3. Post Doctoral Fellow – µTAS Engineer for EI BIMON project (Details...)

For further details contact John Alderman, Bionics Team leader. +353-021 4904396 or [email protected]

To apply for this post, complete the application form and forward with a detailed curriculum vitae and references to: HR Department
Tyndall National Institute, Lee Maltings, Prospect Row, Cork, Ireland; Fax: +353-21-4904058