1. DfMM Training Course "Modelling & Analysis of MEMS Packages", 12-14 Dec 2005, Paris, France

This latest PATENT-DfMM course will introduce to current packaging techniques and in the next track focus on experimental and simulation techniques. The presenters (Olaf Wittler, Fraunhofer IZM, Berlin; Alain Bosseboeuf, IEF, Paris; Ingrid De Wolf, IMEC, Leuven; Andrew Richardson, ULAN, Lancaster; Changhai Wang, HWU, Edinburgh) will cover the following:

- Introduction to MEMS Packaging Techniques and Technology:
Examples of MEMS applications for different markets, Difference between Electronics and MEMS packaging strategies and requirements, Assembly/Interconnection and Encapsulation, Examples of MEMS packaging

- Analysis Techniques for MEMS Packages:
Optical techniques for films/MEMS inspection and mechanical testing before packaging, Testing techniques for wafer bonding and wafer level packaging, Practical training: MEMS characterization by optical profilometry-vibrometry, Hermeticity, Mechanical strength, Failure analysis techniques, Reliability testing, Testing approaches for submicron and nanomechanical material behaviour – A brief overview, Deformation measurements at micro and nano scale by digital image correlation techniques (includes practical training), Residual stress measurements

- MEMS Package Simulation Techniques:
Basic mechanics, Material behaviour and characterisation, Failure mechanisms and life time models (Failure Mechanics, Fracture Mechanics), Basic package MEMS interaction, Practical Training

Reduced rate for all participants from Eastern countries for this course: 200 instead of 900 Euros.

More information: http://www.patent-dfmm.org/site/events/training_courses2005.pdf  
Contact: George Bell, ISLI, UK, E-mail: [email protected]