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Design for Micro & Nano Manufacture PATENT
(Packaging, Test and Reliability Engineering in Micro & Nanosystem Technologies)
Coordinator – University of Lancaster, UK; Dr. A Richardson ([email protected])
NoE FP 6 - priority 2, IST

MICRO AND NANOTECHNOLOGIES BULLETIN Vol. 4/No. 2 and 3; p 4.
MICRO AND NANOTECHNOLOGIES BULLETIN Vol. 5/No. 1; p 2.

PATENT is a reactive initiative that will attempt to realise the vision of providing innovators whether they be members of small companies, universities or multinationals a "predictable" route from M&NT based product concept to product. This will be achieved by realising in the medium to long-term a new concurrent engineering or Design for Micromanufacture Methodology (DfMM) methodology for M&NT-based products that provides designers with the means to design for performance, testability, robustness and dependability competitively, whatever the operating environment. To achieve this vision, major technical challenges need to be solved that are both technically difficult and require workable cross-disciplinary teams.

PATENT will address these challenges by:
 Providing experts with the incentive and resources to cooperate in solving key technical challenges in the fields of modelling and simulation, test engineering, reliability engineering and package engineering.
 Encourage cooperation across these fields and application domains to help realise a new DfMM methodology for M&NT based products.
 Realising critical mass of expertise through the formation of a "virtual institute" across Europe that develops, coordinates and delivers training programs for internal staff and the community. It will also disseminate know-how to peers working within related engineering disciplines and promote awareness and interest in the engineering science associated with the manufacture of M&NT based products.

PATENT will initially involve 10 core partners and 14 associate partners with the support of an industrial steering committee consisting of key future users and suppliers of DfMM methodologies and support tools. The team will function around 6 key "Hubs" that are equipement and infrastructure rich that will provide valuable facilities for all partners. These hubs are - Qinetiq, UK, IMEC, Belgium, Fraunhoffer IZM, Berlin, IEF, Paris, CRL, Leige and NMRC, Cork.

PATENT participants:
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Coordinator - University of Lancaster, UK   Universitaet Bremen, Germany   IMEC, Leuven, Belgium   Universite Paris-sud, Orsay, France   LIRMM, Montpellier II, France   University College Cork - National University of Ireland, Cork, Ireland   QinetiQ Sensors and Electronics, Malvern, UK   National Institute for Microtechnologies Bucharest, Romania   Institute of System Level Integration, Scotland   4M2C, Berlin, Germany   Fraunhofer Institute for Reliability and Microintegration IZM, Berlin, Germany   Fraunhofer-Gesellschaft e.v.- Dresden, Germany   LAAS-CNRS - Paul Sabatier University, Tolouse, France

  Katholieke Universiteit Leuven, Belgium
  Budapest University of Technology & Economics, Hungary
  THALES, Paris, France
  Heriot Watt University, Edinburgh, UK
  Council for the Central Laboratory of the Research Councils, UK
  Politecnico di Milano, Italy
  Fraunhofer Institute for Reliability and Microintegration Munich, Germany
  Warsaw University of Technology, Poland
  Centre Spatial de Liege, Belgium
  Ecole Nationale Superieure d'electronique, Informatique et Radiocommunications, Bordeaux, France
  MESA Research Institute, Twente, Netherlands