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Waferbonding and Active Passive Integration Technology and Implementation (WAPITI)
Coordinator - Fraunhofer Institute for Telecommunications, Heinrich Hertz-Institut, Berlin, Germany;
Dr. Helmut Heidrich ([email protected] )
STREP FP 6 - priority 2, IST

ABSTRACT

  WAPITI`s vision is the development of a novel technology and its implementation in a new mesoscopic device generation that will enable crucial miniaturisation and cost reduction. WAPITI has identified waferbonding as the appropriate technology for the realisation of optical microcircuits integrating passive photonic / active optoelectronical and active photonic driven building blocks for novel functionalities and microsystems.
  WAPITI will demonstrate the potential and versatility of the technology in ring resonator building blocks by realising ultra compact devices for MAN data rates: compact bus integrated ring WDM-lasers (1), high efficiency all-optical wavelength converters (2), and advanced multifunctional devices (3).
   (1) WDM lasers multiplexed in single mode waveguide technology (transparent bus waveguide) are a key buildingblock for SDH/SONET and 2.5/10 GbE applications in the high volume MAN market. Attention will mainly be focussed on obtaining a small die footprint as this is the most crucial cost driving factor.
   (2) All-optical wavelength converters are key components in future versatile optical networks. WAPITI particularily aims to realise efficient wavelength converters based on novel passive bus/active ring architectures.
   (3) Furthermore, WAPITI will investigate, theoretically and experimentally, the possibility of realizing advanced functionalities (e.g. chromatic dispersion compensators, all-optical logic, optical mm wave generation) using the integrated ring structures.
The device development will be supplemented by rigorous modelling and device analysis for component optimisation and exploitation purposes.

       WAPITIs Consortium, Timeline, Volume

      Consortium: 6 partners,4 EU states plus 1 eligible Eastern Europ. state:

For map of partners click here.1. Fraunhofer Institute for Telecommunications, Heinrich Hertz-Institut, Berlin (GERMANY)
2. National Kapodestrian Univ. of Athens (GREECE)
3. Cambridge Univ., Engineering Depart. (UNITED KINGDOM)
4. EV Group, E. Thallner GmbH, Sch�ding (AUSTRIA)
5. Max Planck Institute of Microstructure Physics, Halle (GERMANY)
6. National Institute for R&D in Microtechnologies, Bucharest (ROMANIA)

Timeline target: 36 month
Requested funding ~1.5 million Euro, 262 personal months

WAPITIs Deliverables

Process realisation:

- InP/GaAs waferbonding
- Twin optical layer processing

Devices:

- Bus integrated microring single mode WDM-lasers
- Microring all-optical wavelength converter for 10 Gbit/s applications
- Multifunctional microring building blocks (dispersion compensator, logic devices)

Target Applications:

- Communication networks
- Datacom
- Life science
- Sensors