INTEGRATION OF AN ELECTROMECHANICAL COMPONENT ON A SILICON SUBSTRATE
V. GEORGEL, F. VERJUS, E. C. E. VAN GRUNSVEN, P. POULICHET, G. LISSORGUES, S. CHAMALY

Abstract. This paper presents a packaging method utilizing PICS (Passive Integration Connecting Substrate) and polymer seal ring for dies containing an electro-mechanical component. A Surface Acoustic Wave (SAW) filter, which is a microelectro-mechanical system (MEMS), is used as a capping substrate. The polymer ring acts as a bonding and sealing materials. Two polymers are tested, the Benzocyclobutene (BCB) and the SU-8. The fabrication process is described and the package is characterized in terms of thermal and mechanical strengths. A finite element model with ANSYS, has been performed to simulate the behaviour of the heterogeneous flip-chip package when submitted to thermal and mechanical loads. These results confirm that an integration of such device is possible.