DIMENSIONING OF ELECTROMAGNETIC COUPLERS FOR 0-LEVEL PACKAGED MICROWAVE
POWER LIMITERS BASED ON ELECTRON EMITTER ARRAY
A. PHOMMAHAXAY, G. LISSORGUES, L. ROUSSEAU, T. BOUROUINA, P. NICOLE
This paper presents the development of an RF interconnection method based
on electromagnetic coupling associated with wafer-level packaging aimed at
minimizing the leakage probability. After a discussion on the dimensioning
of the interconnection for different frequency bands, electromagnetic
simulations and measurements will be compared.