CIRCUIT LEVEL INTEGRATION AND PACKAGING TECHNIQUES FOR HIGH-SPEED APPLICATIONS
R.F. DRAYTON, S.R. BANERJEE

Abstract. The need for complex yet portable high speed system design requires development of circuit level integration and packaging methods to manage and control unwanted parasitic effects and undesired coupling in high density configurations. MEMs-based integration and packaging techniques have been developed for microwave/millimeter-wave electronic and optoelectronic applications. These techniques have produced a number of novel interconnect architectures that are suitable for the development of silicon based chip and wafer level packages for electronics and integrated packaging of optoelectronics.